ABB, 5SNA 2400N170300 HiPak IGBT Module

Article source: ABB Library

Ultra low-loss, rugged SPT+ chip-set Smooth switching SPT+ chip-set for good EMC AlSiC base-plate for high power cycling capability AlN substrate for low thermal resistance Improved high reliability package Recognized under UL1557, File E196689

Maximum rated values 1)

1) Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 

2) For detailed mounting instructions refer to Document No. 5SYA 2039

IGBT characteristic values 3)

3) Characteristic values according to IEC 60747 – 9 

4) Collector-emitter saturation voltage is given at chip level

Diode characteristic values 5)

5) Characteristic values according to IEC 60747 – 15 

6) Forward voltage is given at chip level

Package properties 7)

2) For detailed mounting instructions refer to Document No. 5SYA 2039

Mechanical properties 7)

7) Package and mechanical properties according to IEC 60747 – 15

Electrical configuration

Outline drawing 2)

Note: all dimensions are shown in millimeters 

2) For detailed mounting instructions refer to Document No. 5SYA 2039

This is an electrostatic sensitive device, please observe the international standard IEC 60747-1, chap. VIII. 

This product has been designed and qualified for Industrial Level.

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