Quality Warranty

Focused on providing reliable, high-quality solutions.

Committed to Quality.
Our in-house equipment includes thermal, mechanical, moisture, and bond testing.

Bonchip Electronics has significant expertise in stress-testing which enables our customers to accelerate potential failure mechanisms, help identify the root cause, and take actions to prevent failure mode.

MIL-STD-883 TM 5004 and 5005 for Levels B, Q, and V

QML Certification to MIL-PR-38535 cage code (3V146)

In-House DLA lab certified for Group A, B, C and D

Reliability testing to JEDEC standards            


Group A

  • Electrical inspection testing

Group C

  • Life

Group B

  • Resistance to solvents/mark permanency

  • Solderability

  • Bond pull (Destruct and Non-Destruct)

  • Bond shear, die shear, ball shear

Group D

  • Physical dimensions

  • Bending stress and lead Integrity

  • Mechanical and thermal shock

  • Temperature cycle

  • Moisture resistance

  • Variable frequency vibration

  • Constant acceleration

  • Fine leak/gross leak Cond A C

  • Salt atmosphere

  • Adhesion of lead finish

  • Lid torque

  • External visual


  • Preconditioning

  • Temp Cycle


  • HTSL


  • Wetting balance

  • Dip and look